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INTEGRATED CIRCUITS
DATA SHEET
TEA0676T Dual pre-amplifier and equalizer for reverse tape decks
Product specification Supersedes data of 1996 Jun 20 File under Integrated Circuits, IC01 1997 Oct 07
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
FEATURES * Dual head pre-amplifiers * Reverse head switching * Equalization with electronically switched time constants * Output level like Dolby level of 387.5 mV = 0 dB * Improved EMC behaviour. GENERAL DESCRIPTION
TEA0676T
The TEA0676T is a monolithic bipolar integrated circuit intended for applications in car radios. It includes head and equalization amplifiers with electronically switchable time constants. Furthermore it includes electronically switchable inputs for tape drivers with reverse heads. The device will operate with power supplies in a range of 7.6 to 12.0 V. The output overload level increases with the increase in supply voltage, so it is advisable to use a regulated power supply or a supply with a long time constant.
QUICK REFERENCE DATA SYMBOL VCC ICC S+N ------------N Vo (rms) PARAMETER supply voltage supply current signal plus noise-to-noise ratio output voltage (0 dB) (RMS value) VCC = 10 V unweighted RMS value gain internal = 40 dB; linear CONDITIONS MIN. 7.6 - 67 - TYP. 10 10 73 387.5 MAX. 12 13 - - UNIT V mA dB mV
ORDERING INFORMATION TYPE NUMBER TEA0676T PACKAGE NAME SO16 DESCRIPTION plastic small outline package; 16 leads; body width 7.5 mm VERSION SOT162-1
1997 Oct 07
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Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
BLOCK DIAGRAM
TEA0676T
handbook, full pagewidth
180
10 F
equalizer switch 70 s 120 s
330 k
1 k
470 pF IN1
head switch IN2 27 k 10 F
470 pF
10 nF 8.2 k 18 k 10 F OUTB 16 EQSW 15 EQOUTB 14 EQINB 13 GND 12 INB1 11 HSW 10
INB2 9
EQ AMPLIFIER
PREAMPLIFIER
LOGIC
POWER SUPPLY
TEA0676T
EQ AMPLIFIER PREAMPLIFIER
1 OUTA 10 F
2 n.c.
3 EQOUTA 10 nF 8.2 k
4 EQINA
5 VCC
6 INA1
7 Vref
8 INA2
10 V 470 pF 1 k 180 10 F
100 F 470 pF
330 k
MGE862
Fig.1 Block and application diagram.
1997 Oct 07
3
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
PINNING SYMBOL OUTA n.c. EQOUTA EQINA VCC INA1 Vref INA2 INB2 HSW INB1 GND EQINB EQOUTB EQSW OUTB PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DESCRIPTION output channel A not connected output equalizer channel A input equalizer channel A supply voltage input channel A1 (forward or reverse) reference voltage input channel A2 (reverse or forward) input channel B2 (reverse or forward) input head switch input channel B1 (forward or reverse) ground input equalizer channel B output equalizer channel B input equalizer switch output channel B
handbook, halfpage
TEA0676T
OUTA n.c. EQOUTA EQINA VCC INA1 Vref INA2
1 2 3 4
16 OUTB 15 EQSW 14 EQOUTB 13 EQINB
TEA0676T
5 6 7 8
MGE861
12 GND 11 INB1 10 HSW 9 INB2
Fig.2 Pin configuration.
FUNCTIONAL DESCRIPTION Gain of pre-amplifier = 30 dB; minimum gain of EQ-amplifier = 24.5 dB at f = 1 kHz with 70 s cut-off frequency. Head switching is achieved when pin 10 (HSW) is connected to ground via a 27 k resistor (inputs INA2,
INB2 are active) or connected to HIGH level (0.8VCC) (inputs INA1, INB1 are active). Equalization time constant switching (70 s/120 s) is achieved when pin 15 (EQSW) is connected to ground via an 18 k resistor (120 s) or left open-circuit (70 s).
1997 Oct 07
4
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCC V(12-x) Tstg Tamb Ves supply voltage voltage at pins 1 to 11, 13 to 16 with respect to pin 12 storage temperature operating ambient temperature electrostatic handling voltage note 1 note 2 Notes 1. Human body model: C = 100 pF; R = 1.5 k. 2. Machine model: C = 200 pF; R = 0 . THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient in free air VALUE 70 PARAMETER CONDITIONS 0 0 -55 -40 -2000 -500 MIN.
TEA0676T
MAX. 14 VCC +150 +85 +2000 +500 V V
UNIT
C C V V
UNIT K/W
1997 Oct 07
5
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
TEA0676T
CHARACTERISTICS VCC = 10 V; RL = 10 k; CL = 2.5 nF; Tamb = 25 C; Vo = 0 dB means 387.5 mV at output; all levels are referenced to 387.5 mV with 0 dB as standard; EQ switch in 70 s position; unless otherwise specified; see notes 1 and 2. SYMBOL Supply VCC ICC THD HR PSRR cs m ct S+N ------------N supply voltage (pin 5) supply current total harmonic distortion headroom at output power supply ripple rejection channel separation channel matching crosstalk between active and inactive input signal plus noise-to-noise ratio (RMS value) f = 1 kHz; Vo = 0 dB f = 10 kHz; Vo = 6 dB VCC = 7.6 V; THD = 1%; f = 1 kHz VR(rms) < 0.25 V; f = 1 kHz selective measurement; f = 1 kHz; Vo = 10 dB selective measurement; f = 1 kHz; Vo = 0 dB selective measurement; f = 1 kHz; Vo = 10 dB unweighted; f = 20 Hz to 20 kHz; Rs = 0 ; internal gain 40 dB; linear; see Fig.13 unweighted; f = 20 Hz to 20 kHz; Rs = 0 from pin INA1 or INA2 to pin EQINA and from pin INB1 or INB2 to pin EQINB pin INA1 to pin OUTA and pin INB1 to pin OUTB f = 10 kHz f = 400 Hz REQ ZI ZO RL CL Voffset(DC) IO(GND) IO(VCC) EMC equalization resistor input impedance pre-amplifier output impedance EQ-amplifier output load resistance output load capacitance input offset voltage DC current capability DC current capability DC offset voltage at pins 1 and 16 pins INA1, INA2, INB1 and INB2 connected to Vref output to ground output to VCC f = 900 MHz; Vi = 6 V (RMS); see Figs 12, 14 and 15 6 80 104 4.7 60 - 10 0 - -2 300 - 86 110 5.8 100 80 - - 2 - - 50 - - 6.9 - 100 - 10 - - - - dB dB k k k nF mV mA A mV 7.6 - - - 12 - 57 -0.5 70 67 10.0 10 0.08 0.15 - 50 63 - 77 73 12.0 13 0.15 0.3 - - - +0.5 - - V mA % % dB dB dB dB dB dB PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Vno(rms) Gv
equivalent input noise voltage (RMS value) voltage gain of pre-amplifier open-loop amplification
- 29
0.8 30
- 31
V dB
Av
1997 Oct 07
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
SYMBOL PARAMETER CONDITIONS MIN. TYP.
TEA0676T
MAX.
UNIT
Switching thresholds EQUALIZATION TIME CONSTANT SWITCHING VEQSW IEQSW pin voltage input current load current +100 to -100 A VEQSW = 0 to VCC time constant 70 s active time constant 120 s active load current +90 to -90 A VHSW = 0 to VCC inputs INA1 and INB1 active inputs INA2 and INB2 active - -180
1 2VCC
0.8VCC - - + 0.5 - - +180 VCC
1
V A V
VEQSW(HIGH) pin voltage VEQSW(LOW) pin voltage HEAD SWITCHING VHSW IHSW VHSW(HIGH) VHSW(LOW) Notes pin voltage input current HIGH-level pin voltage LOW-level pin voltage
0 - -170
1 2VCC
2VCC - 0.5 V
0.8VCC - - + 0.5 - - +170 VCC
1
V A V
0
2VCC - 0.5 V
1. For an application with a fixed equalization time constant of 120 s the equalizing network may be applied completely external. In this application the 8.2 k resistor has to be changed to 14 k and the internal resistor REQ = 5.8 k must be short-circuited by fixing the equalization switch input at 70 s (pin 15 left open-circuit). To activate the inputs INA1 and INB1, pin 10 (HSW) might be left open-circuit. In this event the DC level at pin 10 (HSW) is 0.8VCC 2. It is recommended to switch off VCC with a gradient of 400 V/s at maximum to avoid plops on the tape in the event of contact between tape and tape head while switching off.
1997 Oct 07
7
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
INTERNAL PIN CONFIGURATIONS
TEA0676T
handbook, halfpage
+
1 5V
handbook, halfpage
+
3 5V
80 100 100
80 5.8 k
MGE863
MGE864
Fig.3 Pins 1 and 16: output channel.
Fig.4 Pins 3 and 14: equalizer outputs.
handbook, halfpage
+
4
handbook, halfpage
5
10 k
1 pF
MGE866 MGE865
Fig.5 Pins 4 and 13: equalizer inputs.
Fig.6 Pin 5: supply voltage.
1997 Oct 07
8
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
TEA0676T
handbook, halfpage
6 5V +
handbook, halfpage
+
2.5 k 7 220 100 k 5V
MGE867
5V 2.5 k
12 pF
MGE868
Fig.7 Pins 6, 8, 9, 11: input channel.
Fig.8 Pin 7: reference voltage.
handbook, halfpage
10 8V +
handbook, halfpage
15 8V +
MGE869
MGE870
Fig.9 Pin 10: input head switch.
Fig.10 Pin 15: input equalizer switch.
1997 Oct 07
9
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
TEST AND APPLICATION INFORMATION
TEA0676T
handbook, full pagewidth
180
10 F
10 k
equalizer switch 70 s 120 s
330 k
1 k
200 10 F
470 pF IN1
head switch IN2 27 k 10 F 10 F
470 pF 200
10 nF 8.2 k 18 k 10 F OUTB 16 EQSW 15 EQOUTB 14 EQINB 13 GND 12 INB1 11
HSW 10
INB2 9
EQ AMPLIFIER
PREAMPLIFIER
LOGIC
POWER SUPPLY
TEA0676T
EQ AMPLIFIER PREAMPLIFIER
1 OUTA 10 F
2 n.c.
3 EQOUTA 10 nF 8.2 k
4 EQINA
5 VCC
6 INA1
7 Vref
8 INA2 200
10 V 200 330 k 1 k 180 10 F
10 F 470 pF
100 F
10 F 470 pF
10 k
MGE871
Fig.11 Test circuit.
1997 Oct 07
10
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
TEA0676T
handbook, full pagewidth
10 k
200
470 pF IN1
head switch IN2 27 k
200 10 F
470 pF
20 k 10 F OUTB 16 EQSW 15 EQOUTB 14 EQINB 13 GND 12 INB1 11 HSW 10
INB2 9
EQ AMPLIFIER
PREAMPLIFIER
LOGIC
POWER SUPPLY
TEA0676T
EQ AMPLIFIER PREAMPLIFIER
1 OUTA 10 F
2 n.c.
3 EQOUTA 20 k
4 EQINA
5 VCC
6 INA1
7 Vref
8 INA2
10 V 200 470 pF
100 F 200 470 pF
10 k
10 40 f = 900 MHz Vi = 6 V (RMS)
MGE872
Fig.12 EMC test diagram.
1997 Oct 07
11
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
TEA0676T
handbook, full pagewidth
equalizer switch 70 s 120 s
10 k
head switch IN1 IN2 27 k 10 F
20 k 18 k 10 F OUTB 16 EQSW 15 EQOUTB 14 EQINB 13 GND 12 INB1 11 HSW 10
INB2 9
EQ AMPLIFIER
PREAMPLIFIER
LOGIC
POWER SUPPLY
TEA0676T
EQ AMPLIFIER PREAMPLIFIER
1 OUTA 10 F
2 n.c.
3 EQOUTA 20 k
4 EQINA
5 VCC
6 INA1
7 Vref
8 INA2
10 V
100 F
10 k
MGE873
Fig.13 Noise test diagram.
1997 Oct 07
12
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
LAYOUT OF PRINTED CIRCUIT BOARD FOR EMC TEST CIRCUIT
TEA0676T
handbook, full pagewidth
54
50
200 470 pF
27 k
200 470 pF 10 k 20 k
40
0 100 nF
0 100 nF
10 0
TEA0676T
0 20 k 10 k 470 pF 200
MBH457
470 pF 200
Fig.14 Top side with components.
1997 Oct 07
13
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
TEA0676T
handbook, full pagewidth
54
50
10 F 10 F S1 MP X3 100 F 100 F
X2
X4 MP HFDR. MP
10 F X1
MBH458
Fig.15 Bottom side with components.
1997 Oct 07
14
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
PACKAGE OUTLINE SO16: plastic small outline package; 16 leads; body width 7.5 mm
TEA0676T
SOT162-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 A1 pin 1 index Lp L 1 e bp 8 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT162-1 REFERENCES IEC 075E03 JEDEC MS-013AA EIAJ EUROPEAN PROJECTION A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 10.5 10.1 0.41 0.40 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
ISSUE DATE 95-01-24 97-05-22
1997 Oct 07
15
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering
TEA0676T
Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1997 Oct 07
16
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TEA0676T
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1997 Oct 07
17
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
NOTES
TEA0676T
1997 Oct 07
18
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for reverse tape decks
NOTES
TEA0676T
1997 Oct 07
19
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997
Internet: http://www.semiconductors.philips.com
SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
547027/1200/02/pp20
Date of release: 1997 Oct 07
Document order number:
9397 750 02743

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